ALL OF THE TECHNOLOGIES FOR HIGH-TECH CONROD PRODUCTION IN ONE PLACE

FASTER AND MORE COST EFFECTIVE

Laser cracking is a patented process owned by MAUSER, patent no. DE203202999, No. DE10325910.

Laser cracking is a lot more time and cost effective than conventional splitting and machining technologies.

When a workpiece is cracked (fracture-splitted), the surface of the fracture will have a microstructure that ensures that the two fractured ends will form a positive joint when they are bolted together. During this process, a laser is used to pre-determine a groove on the workpiece at the intended breaking point and thus removes the need for conventional splitting.

The advantages of laser cracking compared to conventional procedures:

• 50 % reduction of the machining operations normally required to split a workpiece
• Greatly simplifies the splitting process
• Increases the process reliability and the quality of the assembled workpiece
• Reduces the amount of floor space required for production
• Increases the process quality